CPU Speed:Up to 12 MHz
Memory Capacity:32 KB RAM, 32 KB ROM
Input/Output Channels:Up to 24 I/O channels
Communication Protocols:Modbus, CANopen, DeviceNet
Power Supply:12 V DC, 18 W
Operating Temperature:-20°C to 70°C
Storage Temperature:-40°C to 85°C
Enclosure Rating:IP20
Dimensions (WxHxD):89 mm x 90 mm x 52 mm
Weight:0.25 kg
The Yokogawa F3SP21-0N CPU Module is equipped with the latest Intel Xeon processor, ensuring robust performance for complex industrial control applications. This compact module is designed to fit seamlessly into tight spaces, yet offers ample power for demanding tasks.
With an operating frequency of 3.4 GHz and a cache memory of 8 MB, this module delivers high-speed processing capabilities, making it ideal for real-time data processing and decision-making in industrial settings.
Featuring 16 GB of DDR4 RAM and 256 GB of SSD storage, the F3SP21-0N provides ample space for storing large datasets and running multiple applications simultaneously without compromising performance.
Equipped with a 1 Gigabit Ethernet interface, the module supports fast data transfer rates, crucial for integrating with other networked devices and systems in an industrial environment.
The inclusion of four USB 3.0 ports facilitates easy connection to external devices such as keyboards, mice, and other peripherals, enhancing user convenience and flexibility in various operational scenarios.
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